Wafer processing
Laser cutting is a non-contact cutting technology that can cut semiconductor materials accurately and efficiently. The wafer cutting laser launched by PreciLasers has achieved high-quality cutting on a variety of wafer materials.
Wafer cutting laser
Real photos | wavelength | power | Introduction | Features |
 | 20W | Infrared laser with editable pulse length and waveform, pulse width CW-10ns continuously adjustable, to achieve precise processing of wafers |
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